Molecular dynamics simulation of microcrack healing in copper nanoplate
The molecular dynamics method is used to simulate microcrack healing in copper nano-plate during heating.During microcrack healing,the tip of microcrack is blunted and deforms to round shape,the microcrack becomes smaller and smaller until it is healed through slip bands emitting from the pre-crack tip and expanding to the top and bottom of the copper nano-plate.The healing time is different in different temperature.The healing processes in different temperature present different slip bands for crack healing.When temperature is below 650K,the healing time decreases dramatically with temperature increase.When temperature is above 650K,the healing time decreases smoothly with temperature increase.The critical temperature of microcrack healing in copper nano-plate without pre-existing dislocations is about 400K.
Crack healing Copper Molecular dynamics simulation
Meifen Wang Guojun Du Dongyu Xia
Department of Engineering Mechanics, school of Civil Engineering & Mechanics, Yanshan University, Qinhuangdao 066004,China
国际会议
广州
英文
454-457
2012-11-16（万方平台首次上网日期，不代表论文的发表时间）