Industrial Action Research on Thickness Uniformity of Magnetron Sputter Coating
Sputter coating method has the characteristics of high sputter rate,low substrate temperature,good adhesion to substrate,components easy to control etc,therefore,which was widely used in coating industry.In planar magnetron sputter coating system,film thickness uniformity is an important index to measure film quality and film system performance and was studied widely in the world.This article takes magnetron sputter technology on deposition of Cu film based on Si (100)substrate and average thickness distribution of film along sample tray in radial direction was researched and studied through scanning electronic microscopy (SEM) and mathematical-physical model was established on this to study the uniformity of film distribution.As the experiment result suggests uneven distribution of film on the substrate,starts with centre of tray,with radius increasing,film thickness reduces gradually,with target-substrate distance increasing,the thickness of film reduces gradually,while its uniformity gets improved gradually.Three-dimensional and two-dimensional distribution diagram were obtained by theoretical calculation and computation result was basically consistent with experiment result in the trend.
Magnetron sputters method round-planar target sputter rate target distance film thickness distribution
Chu Zhibing Tang Bin Lin Naiming
Heavy Machinery Engineering Research Center of the Ministry of Education, Taiyuan University of Scie Research Institute of Surface Engineering, Taiyuan University of Technology , Taiyuan, 030024, Shanx
国际会议
上海
英文
121-121
2012-10-19（万方平台首次上网日期，不代表论文的发表时间）