The efficiency of thermoelectric chip by different heatsink

摘要：

　　In this study,aluminum nitride,boron nitride,copper,aluminum,with aluminum extruded heat sink as a cooling way of thermoelectric chip.Heat sink temperature change observed and measured the thermoelectric chip output voltage and current.

关键词： thermoelectric chip Heatsink aluminum nitride boron nitride

作者: Wern-Dare Jheng Shao-Hsien Chen Zhi-Yu Lin

作者单位: Department of Mechanical Engineering, National Chin-Yi University of Technology, No.35, Lane215, Section 1, Chung-Shan Road, Taiping 411, Taichung, Taiwan

会议类型: 国际会议

会议名称: the Second International Conference on Frontiers of Manufacturing and Design Science(第二届制造与设计科学国际会议(ICFMD 2011))

会议地点: 台湾

会议语种:英文

页码: 2974-2978

在线出版日期: 2011-12-11（万方平台首次上网日期，不代表论文的发表时间）