Verification of Non-Uniform Heat-Conducting Interphase by Using Finite Element Method

摘要：

　　In this paper,various temperature distributions on a thin resistant interphase layer bonded between two different materials were studied.The numerical finite element analysis for heatconduction problems is considered for two cases:namely,a temperature-dependent source or sink and non-uniform temperature distributions at the surfaces and non-uniform source distributions into the intermediate layer.The finite element analysis shows good performance for thin heat conducting adhesive layers.

关键词： Imperfect interface Non-uniform Finite element analysis Interphase

作者: Hamid Mozafari Behzad Abdi Amran Ayob Amran Alias

作者单位: Faculty of Mechanical Engineering, Universiti Teknologi Malaysia, 81310-UTM, Skudai, Johor,Malaysia

会议类型: 国际会议

会议名称: the Second International Conference on Frontiers of Manufacturing and Design Science(第二届制造与设计科学国际会议(ICFMD 2011))

会议地点: 台湾

会议语种:英文

页码: 4897-4901

在线出版日期: 2011-12-11（万方平台首次上网日期，不代表论文的发表时间）