Creep-Recovery Behaviors of Anisotropic Conductive Adhesive Film With Temperature and Hygrothermal Aging

摘要：

　　The effects of temperature,stress level and hygrothermal aging on the creep-recovery behaviors of anisotropic conductive adhesive film (ACF) were investigated experimentally using a dynamic mechanical analyzer (DMA).It is found that the initial strains,instantaneous strains and creep or recovery rates increase with increasing temperature,however decrease with increasing hygrothermal aging time.The change of creep or recovery rates at low temperature is apparent; however the creep or recovery rates increase obviously at temperatures above 25 ℃ with increasing stress level.For the hygrothermal aged ACF,the time to reach steady creep stage or steady recovery stage is reduced significantly compared with the unaged sample.The strain jumps at instantaneous loading decrease visibly and the strain jumps at instantaneous unloading decrease slightly with increasing aging time.And the strain jumps at instantaneous loading and unloading increase with increasing stress level for the unaged and aged ACFs.

关键词： Anisotropic conductive adhesive film (ACF) Creep-recovery Temperature dependence Hygrothermal aging

作者: Lilan Gao Xu Chen Hong Gao

作者单位: School of Mechanical Engineering,Tianjin University of Technology,Tianjin 300384,China;School of Che School of Chemical Engineering and Technology,Tianjin University,Tianjin 300072,China

会议类型: 国际会议

会议名称: The 6th Cross-Strait Conference on Advanced Engineering Materials (第六届海峡两岸工程材料研讨会)

会议地点: 南京

会议语种:英文

页码: 16-21

在线出版日期: 2011-11-08（万方平台首次上网日期，不代表论文的发表时间）