Thermal Expansion of Anti-Perovskite Mn3Zn1-xSnxN Compounds

摘要：

　　The anti-perovskite structured Mn3XN(X=Cu,Al,Ag,Zn,Ga,Sn,In) have wide perspective and practicability with unique advantages compared with other materials as a new negative thermal expansion (NTE) material.Because of its simple preparation and unique properties of NTE,this kind of compounds aroused scientists attention.The metallic nitrides Mn3Zn1-xSnxN (x=0.1,0.2,0.3,0.4,0.5) were prepared by solid-state sintering.The anti-perovskite compound Mn3Zn1-xSnxN has a cubic crystal structure with space group Pm3m.It shows that Zn element is partial replaced by Sn element.The Sn doping in Mn3Zn1-xSnxN compound can cause the thermal expansion behavior of the compound to change between positive and negative by analyzing the curve of thermal expansivity with the temperature.Mn3Zn0.7Sn0.3N shows a very strong NTE.Its negative thermal expansion coefficients were-4.39× 10-4/K from 345.4 ℃ to 476.2 ℃.In addition,the variation of the thermal expansion curve for Mn3Zn0.8Sn0.2N is almost negligible with the increasing of temperature to 600 ℃,exhibiting nearly zero thermal expansion behavior.Therefore,the thermal expansion of Mn3Zn1-xSnxN could be tuned via different contents of Sn in Mn3ZnN.

关键词： anti-perovskite manganese nitrides thermal expansion Sn doped

作者: Xuehua Yan Jiaqi Liu Zhuyuan Hua Bingyun Li Xiaonong Cheng

作者单位: School of Materials Science and Engineering,Jiangsu University,Zhenjiang,Jiangsu,212013,China

会议类型: 国际会议

会议名称: The Seventh China International Conference on High-Performance Ceramics (第七届先进陶瓷国际研讨会(CICC-7))

会议地点: 厦门

会议语种:英文

页码: 890-893

在线出版日期: 2011-11-04（万方平台首次上网日期，不代表论文的发表时间）