A Three-dimensional Hydrodynamic Lubrication Model for Chemical-mechanical Polishing Considering Pad Roughness

摘要：

　　A three-dimensional hydrodynamic lubrication model based on lubrication theory is developed which accounts for pad roughness and slurry flow.The distribution of the slurry film thickness and pressure between the pad and the wafer are predicted using the model.The effects of the pad roughness,the polishing applied load and rotation speed on slurry film thickness and tilt angle are discussed.At last,a CMP experiment is carried out.It is found that the results are proved the three-dimensional model considering pad roughness agrees well with our experimental data.The results improve the previous models so that the CMP process can be better simulated using the model.Furthermore,they are useful in the processing of CMP and the design of the pad roughness.

关键词： Chemical mechanical polishing (CMP) Roughness Tilt angle Film thickness

作者: Feiyan Lou

作者单位: College of Education Science and Technology, Zhejiang University of Technology,Hangzhou, 310014,China

会议类型: 国际会议

会议名称: the 2010 International Conference on Frontiers of Manufacturing and Design Science(第一届制造与设计科学国际会议(ICFMD 2010))

会议地点: 重庆

会议语种:英文

页码: 1213-1217

在线出版日期: 2010-12-11（万方平台首次上网日期，不代表论文的发表时间）