Polishing Mechanism and Technology of Hard Disk Substrates by Colloidal Silica Alkaline Slurry
Chemical mechanical polishing (CMP) has been a widely applied process for nickel-phosphorus (Ni-P) coating hard disk substrate polishing.In this study,colloidal silica-based alkaline slurry was prepared for polishing Ni-P plated substrates and its CMP mechanism was studied with alkali slurry.Effects of the various process parameters such as polishing pressure and plate speed on hard disk substrate were investigated.The results show that the polishing pressure and plate speed have a strong influence on the material removal rate and surface roughness of the hard disk substrate.The oxidization layer formed on hard disk substrate surface after polishing.The nickel ions were bounded with amidocyanogen to form stable and soluble macromolecular amidocyanogen-complex agent,improved selectivity of convex region and concave region,enhanced the chemical reaction uniformity and the mass transfer velocity,and thus high removal rate and low surface roughness could be realized.
Hard disk substrate Alkaline slurry Polishing mechanism Removal rate
Shengli Wang Zhenxia Li Libing Yang Yu Tian Huilai Mu
Institute of Microelectronics, Hebei University of Technology, Tianjin, 300130, China School of Architecture, Hebei University of Technology, Tianjin, 300401, China
国际会议
重庆
英文
3072-3076
2010-12-11（万方平台首次上网日期，不代表论文的发表时间）