Thermal Conductivities of β-Si3N4 and BN-filled Epoxy Molding Compounds (EMC)

摘要：

　　New electric molding composites were fabricated with hybridizing epoxy and several fillers.The examined fillers were β-Si3N4,BN and fused silica or their combinations.The thermal conductivity of β-Si3N4 filler was compared with BN as filler for advanced epoxy molding compounds.The influence of pure resin matrix and mixture matrix on the thermal conductivity of EMC was discussed.The results were explained with Maxwell equation.

关键词： β-Si3N4 BN Molding composite Thermal conductivity

作者: Zhu Yuan K.X.Chen

作者单位: Department of Materials Science and Engineering,State Key Laboratory of New Ceramics and Fine Processing,Tsinghua University,Beijing 100084,P.R.China

会议类型: 国际会议

会议名称: The Fifth China International Conference on High-Performance Ceramics (第五届先进陶瓷国际研讨会(CICC-5))

会议地点: 长沙

会议语种:英文

页码: 1071-1073

在线出版日期: 2007-05-10（万方平台首次上网日期，不代表论文的发表时间）