Joining TiB2-Ni cermets with Ti6Al4V by Pulse Current Heating

摘要：

　　Pulse current heating technology is used to join TiB2-Ni cermets with Ti6Al4V at different temperatures (1023 K,1073K and 1123K) with 7MPa pressure and Cu foil and Ni foil are used as joining interlayer.Joint points increase with welding temperature.The microstructure of joints is observed through SEM images and micrographs.The diffusion coefficient (Do) of Cu at the Cu/TiB2 interface is calculated by the EPMA patterns.The diffusion principle of pulse current heating and influences of electric field and current on atom diffusion are studied.

关键词： Pulse current heating Microstructure analysis Atom diffusion Joining

作者: Y.Peng Z.Y.Fu W.M.Wang H.Wang Y.C.Wang J.Y.Zhang Q.J.Zhang

作者单位: State Key Lab of Advanced Technology for Materials Synthesis and Processing,Wuhan University of Technology,Wuhan City,Hubei Province,P.R.China,430070

会议类型: 国际会议

会议名称: The Fifth China International Conference on High-Performance Ceramics (第五届先进陶瓷国际研讨会(CICC-5))

会议地点: 长沙

会议语种:英文

页码: 1609-1611

在线出版日期: 2007-05-10（万方平台首次上网日期，不代表论文的发表时间）