Solution Processed Encapsulation for Organic Solar Cells
The development of thin film barrier encapsulation layers and flexible substrates have been identified as key technologies for flexible active matrix organic light emitting diode (AMOLED) displays.1 The encapsulation procedure with cap glass is commonly used for organic photovoltaic (OPV) and OLED.But,there are some disadvantages with glass encapsulation like rigidness,fragileness and thick device.This paper reports new encapsulation methods for OPV,which can replace glass encapsulation.We have studied the OPV encapsulation using multi layers formed by spin coating of UV resin and subsequent UV exposure.The OPV structure is ITO/ZnO (40 nm)/P3HT:PCBM (80 nm)/PEDOT:PSS + PTE (40 nm)/Al.The inverted OPV structure was adopted because of its environment stability.2,3 Degradation of the device with thin film encapsulation over 48 h was 12.9% compared with glass encapsulation where the degradation was only 4.74%.
Hee-Jae Lee Hyeong-Pil Kim Hyo-Min Kim Jun-Ho Youn Mi-Sun Ryu Abd Rashid bin Mohd Yusoff Jin Jang
Department of Information Display and Advanced Display Research Center,Kyung Hee University, Dongdaemoon-ku, Seoul 130-701, Korea
国际会议
The 22nd International Photovoltaic Science and Engineering Conference (第22届国际光伏科学与工程会议)
杭州
英文
1-4
2012-11-05（万方平台首次上网日期，不代表论文的发表时间）