Finite Element Analysis of Failure in Cu Interconnect Megasonic Cleaning

摘要：

　　Megasonic cleaning has been one of the most successful techniques for Cu/low-k interconnects post-CMP cleaning.The structural deformation and stress of Cu and low-k materials in megasonic cleaning are examined with finite element method (FEM).The maximum stress is concentrated in the binding area between Cu and low-k.With decrease of Cu line width,the maximum stress increases and the max value exceeds the yield strength of Cu which results in the plastic deformation.The increasing frequency will change the bubble collision times.Therefore the fatigue is potential.The maximum displacement moves from center to the sides of top surface with increase of line width.When the line width is 25nm,the deformation is the largest.

关键词： Post-CMP cleaning Megasonic Cu interconnects Finite element method (FEM)

作者: Yating Huang Chunling Meng Nianpeng Wu Xiuping Dong Xinchun Lu

作者单位: School of Material and Mechanical Engineering, Beijing Technology and Business UniversityBeijing, Ch State Key Laboratory of Tribology, Tsinghua University, Beijing, China

会议类型: 国际会议

会议名称: 中国微米纳米技术学会第14届学术年会、第3届国际年会暨第6届微米纳米技术“创新与产业化国际研讨与展览会(CSMNT2012 & ICMAN2012)

会议地点: 杭州

会议语种:英文

页码: 1-6

在线出版日期: 2012-11-04（万方平台首次上网日期，不代表论文的发表时间）