Study on forming of polymer microstructure by heat-assisted ultrasonic embossing

摘要：

　　In order to be better applied to the forming of polymer micro-devices,we design orthogonal experiment based on thermal-assisted ultrasonic embossing technology and analysis the effect of heat-assisted temperature 、ultrasonic embossing parameters and the thickness of polymer substrate on the forming results,and optimize process parameters to improve replication accuracy of microstructure on the substrate.Experimental results show that when the hot secondary temperature is 70 oC、ultrasonic embossing is 300 N、ultrasonic amplitude is 9.6 μm and ultrasound time is 20 s,microstructures on a substrate of copying works best; Under the same experimental parameters,PMMA substrate which the thick is 1mm has a far greater copy effects than the 2 mm substrate.In the structure of high quality imprint,the analytical results contribute to the microstructure of polymer ultrasonic embossing technology applied further in the field of precision stamping.

关键词： Heat-assisted Ultrasonic embossing Orthogonal experiment

作者: YAN Xu LUO Yi QI Ji QI Na Wang Xiao-dong

作者单位: Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, Dalian 116023, China

会议类型: 国际会议

会议名称: 中国微米纳米技术学会第14届学术年会、第3届国际年会暨第6届微米纳米技术“创新与产业化国际研讨与展览会(CSMNT2012 & ICMAN2012)

会议地点: 杭州

会议语种:英文

页码: 1-6

在线出版日期: 2012-11-04（万方平台首次上网日期，不代表论文的发表时间）