A SOI-MEMS Piezoresistive Atmosphere Pressure Sensor
In this paper,a SOI-MEMS (silicon on insulator- micro electro mechanical system) pizeoresistive atmosphere pressure sensor is presented using anodic bonding.Differently from the prevailing fabrication process of silicon piezoresistive pressure sensor: the device layer monocrystalline of SOI silicon wafer is used as the strain gauge with a simple deep etching process; and the SiO2 layer of SOI silicon wafer as the insulator between strain gauge and substrate.The whole fabrication processes of the designed sensor are very simple,and can reduce the cost of sensor.The Pressure-Voltage characteristic test results suggest a precision within 0.14% in linear fitting.It is shown that the temperature coefficient is 2718ppm/℃ from the Typical temperature curve of the pressure sensors.
MEMS Pressure Sensor Piezoresistive
Lidong Du Zhan Zhao Li Xiao Meng ying Zhang Zhen Fang
State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy ofSciences, State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy ofSciences,
国际会议
中国微米纳米技术学会第14届学术年会、第3届国际年会暨第6届微米纳米技术“创新与产业化国际研讨与展览会(CSMNT2012 & ICMAN2012)
杭州
英文
1-4
2012-11-04(万方平台首次上网日期,不代表论文的发表时间)