Wafer Level Vacuum Packaging for MEMS Using Glass Frit Bonding
Wafer level glass frit bonding is an important technology for the hermetic encapsulation of micro-electro-mechanical systems (MEMS).In this paper,thermogravimetry/differential scanning calorimetry (TG/DSC) thermal analysis techniques are employed to investigate the sintering characteristics of the glass frit material.TG/DSC measurement results illustrate that organic binder burnout temperature and glass transition temperature for the glass frit used in this work are 300 ℃ and 331 ℃,respectively.Based on TG/DSC measurement,a wafer level glass frit vacuum packaging approach for MEMS is developed.Application of this approach for a thermocouple vacuum gauge is demonstrated,which is used to measure the vacuum degree in the packaged cavity.The measured results show that vacuum about 100 Pa - 300 Pa can be sealed using this approach.
Micro-electro-mechanical systems (MEMS), glass frit bonding TG/DSC vacuum package wafer-level package thermocouple vacuum gauge
Guoqiang Wu Dehui Xu Bin Xiong Yuelin Wang
State Key Laboratory of Transducer Technology, Science and Technology on Micro-systemLaboratory, Sha State Key Laboratory of Transducer Technology, Science and Technology on Micro-systemLaboratory, Sha
国际会议
中国微米纳米技术学会第14届学术年会、第3届国际年会暨第6届微米纳米技术“创新与产业化国际研讨与展览会(CSMNT2012 & ICMAN2012)
杭州
英文
1-4
2012-11-04（万方平台首次上网日期，不代表论文的发表时间）