Experimental Investigation of the Thermal Conductivity of the Titanium Carbide Thin Films on Silicon Substrate

摘要：

　　Thermal conductivities of the titanium carbide thin films with thickness ranging from 58 to 158 nm were measured at room temperature using the transient thermoreflectance technique.The results show that thermal conductivities of these films are lower than corresponding bulk material values.The reduction in the thermal conductivity can be attributed to the material microstructure brought by the thin film fabrication process.Both the film thickness and the atom ratio of Ti/C are the important factors.The thermal conductivity increases with the increasing of film thickness and atom ratio of Ti/C.It also indicates that the material beneficial to thermal management and thermal design could be fabricated by improvement of the deposition techniques.

关键词： thermal conductivity titanium carbide thin film transient thermoreflectance technique

作者: Suyuan Bai Zhengxing Huang Zhenan Tang

作者单位: School of Materials Science and Engineering, Dalian University of Technology, Dalian, CHINA;School o School of Electronic Science and Technology, Dalian University of Technology, Dalian, CHINA

会议类型: 国际会议

会议名称: 中国微米纳米技术学会第14届学术年会、第3届国际年会暨第6届微米纳米技术“创新与产业化国际研讨与展览会(CSMNT2012 & ICMAN2012)

会议地点: 杭州

会议语种:英文

页码: 1-5

在线出版日期: 2012-11-04（万方平台首次上网日期，不代表论文的发表时间）