Modeling of Multiphysics Coupling and Performance Analysis of Electrothermal Microactuator
Electrothermal microactuators have a very promising future in MEMS applications since they can generate large deflection and force with low actuating voltages and small device areas.In this paper,a temperature distribution and unload displacement model of an electrothermal microactuator is presented.In order to prove the accuracy of the model,finite element analysis (FEA) and experimental results are provided.The results of temperature profile and unload displacement output,which are from the model calculation,FEA and experimental test,agree well with each other.It gives an indirect proof that the model is correct and FEA calculation is practicable.It can be shown that the shape of the actuator has no effect on the maximum temperature,and the unload displacement and output force depend on the beam length and inclined angle of the actuator.
MEMS Electrothermal Microactuator Multiphysics Coupling Temperature Profile Performance Analysis
WANG Zhenlu SHEN Xuejin ZHOU Ling CHEN Xiaoyang
Department of Mechanical Automation Engineering, Shanghai University, Shanghai 200072, China;LanZhou Department of Mechanical Automation Engineering, Shanghai University, Shanghai 200072, China
国际会议
中国微米纳米技术学会第14届学术年会、第3届国际年会暨第6届微米纳米技术“创新与产业化国际研讨与展览会(CSMNT2012 & ICMAN2012)
杭州
英文
1-5
2012-11-04（万方平台首次上网日期，不代表论文的发表时间）