Transient Pull-in Analysis of Micro-Plate with Fluid-Structure Interactions
Electrostatic micro-devices are simple but important for MEMS applications.Due to the electrostatic nonlinearity and the fluid-structure interactions in devices,precise dynamic descriptions of these devices are often hard to obtain.Here we present a comprehensive electrostatic-mechanicalfluidic coupling transient analysis of the pull-in process of two ends fixed micro-plate.The numerical results are compared with the published experiment work of other researchers available in the literature,and thus validate the model.The proper orthogonal decomposition approach is performed for the snapshot matrixes of pressure and deflections which are sampled from an ensemble of the fully finite element results.The resulted spatial distribution modes of those two sate variables indicated that the pressure modes show a higher spatial frequency toward the middle of the micro-plate and the pressure ate the moving edges of the plate are not equal to ambient pressure.Due to the increasing demands for accuracy,the electrostatic-mechanical interactions and the nonlinear features of viscous loss from the surrounding have to be taken into account in detail.
Pull-in Fluid-structure interaction, Electrostatic-mechanical interaction Numerical simulation
X.Z.Lin J.Ying J.M.Huang
College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, Fujian, CHINA Institute of Modern Manufacturing Engineering of Zhejiang University, Hangzhou, Zhejiang, CHINA
国际会议
中国微米纳米技术学会第14届学术年会、第3届国际年会暨第6届微米纳米技术“创新与产业化国际研讨与展览会(CSMNT2012 & ICMAN2012)
杭州
英文
1-6
2012-11-04（万方平台首次上网日期，不代表论文的发表时间）