Effect of pH on hard disk substrate polishing in glycine-hydrogen peroxide system abrasive-free slurry
The effect of pH on the material removal rate (MRR) and surface roughness (Ra) of hard disk substrate in glycine–hydrogen peroxide system abrasive-free slurry was investigated.The results show that,the MRR of hard disk substrate increases when both glycine and H2O2 are used in acidic slurries (pH=3.0) and decreases drastically in alkaline slurries (pH=10.0).The Ra of hard disk substrates is small in acidic slurries and increases drastically in alkaline slurries.Further,the effects of glycine,H2O2,and solution pH on hard disk removal were investigated by auger electron spectroscopy (AES),electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization measurements.We also develop a reaction scheme describing the surface chemistry of the hard disk in this system.
abrasive free polishing (AFP) glycine hydrogen peroxide hard disk substrate
Chen Sisi Lei Hong Chen Ruling
Research Centre of Nano-science and Nano-technology, Shanghai University,Shanghai 200444, China
国际会议
中国微米纳米技术学会第14届学术年会、第3届国际年会暨第6届微米纳米技术“创新与产业化国际研讨与展览会(CSMNT2012 & ICMAN2012)
杭州
英文
1-6
2012-11-04(万方平台首次上网日期,不代表论文的发表时间)