FEM simulation of the thermo-mechanical behavior of TSV 3D MEMS structure

摘要：

　　As pitch of TSV shrinks down,mechanical characteristics of TSVs become more complicated and the heat of chip becomes a critical issue.The objective of this paper is to study thermal mechanical characteristics of ultra-fine pitch TSV.The thermal-mechanical characterization of an ultra-fine pitch chip is simulated with FEA.

关键词： FEM simulation thermo-mechanical Though Silicon Via (TSV) 3D MEMS

作者: Xin Gong Guanjiang Wang Jing Chen Yufeng Jin

作者单位: National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University,Beiji National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University,Beiji

会议类型: 国际会议

会议名称: 中国微米纳米技术学会第14届学术年会、第3届国际年会暨第6届微米纳米技术“创新与产业化国际研讨与展览会(CSMNT2012 & ICMAN2012)

会议地点: 杭州

会议语种:英文

页码: 1-6

在线出版日期: 2012-11-04（万方平台首次上网日期，不代表论文的发表时间）