Evaluation Methods on Adhesion Property between SU-8 Photoresist and Metal Substrate
During the fabrication process of metal microdevice by SU-8 UV-LIGA technology,due to the poor adhesion strength between SU-8 photoresist and metal substrate it is common for interface separated and bind failure.In this paper pull-off test,scratch test and indentation test were performed to evaluate the adhesion property between SU-8 photoresist and metal substrate,and the feasibility of these three methods was compared.The result shows that the pull-off test fails to evaluate real interface adhesion strength because the great possibilities of mixed debond appearance which makes the experimental data discrete and inaccurate.The scratch test and the indentation test can efficiently and accurately evaluate the interface adhesion strength between SU-8 photoresist and metal substrate and are demonstrated two preferable methods.
pull-off test scratch test indentation test adhesion property SU-8 photoresist metal substrate
Xiaolei Zhang Liqun Du Aoan Wang
Key Laboratory for Precision & Non-traditional Machining Technology of Ministry of Education, Dalian Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University ofTechno
国际会议
中国微米纳米技术学会第14届学术年会、第3届国际年会暨第6届微米纳米技术“创新与产业化国际研讨与展览会(CSMNT2012 & ICMAN2012)
杭州
英文
1-6
2012-11-04（万方平台首次上网日期，不代表论文的发表时间）