Electrical Characterization of Integrated Passive Devices (IPD) Using Thin Film Technology for 3D Integration

摘要：

　　With the development of 3D integration technology,microsystems with vertical interconnects are attracting attention from researchers and industry applications.Basic elements of integrated passive devices (IPD),including inductor,capacitor and resistor,could dramatically save the footprint of the system,optimize the form factor and improve performance of radio frequency (RF) systems.In this paper,IPD using thin film built-up technology will be introduced,and the design and characterization of CPWs,inductors and capacitors will be presented as well.

关键词： Integrated passive devices (IPD) BCB thin film inductor capacitor

作者: Xin SUN Yunhui ZHU Qinghu CUI Shenglin MA Jing CHEN Min MIAO Yufeng JIN

作者单位: National Key Laboratory of Science and Technology on Micro/Nano Fabrication,Peking University, ＃5, Y Info. Microsystem Inst., Beijing Information Science & Technology Univ., Beijing, 100085, China

会议类型: 国际会议

会议名称: 中国微米纳米技术学会第14届学术年会、第3届国际年会暨第6届微米纳米技术“创新与产业化国际研讨与展览会(CSMNT2012 & ICMAN2012)

会议地点: 杭州

会议语种:英文

页码: 1-6

在线出版日期: 2012-11-04（万方平台首次上网日期，不代表论文的发表时间）