A Microfluidic Chip Microwave Bonding Method Based on the PMMA
A new bonding technique mainly for PMMA microfluidic chips is presented in this paper.In this technique,polymer microfluidic microchannels were bonded by microwave radiation.Its strength and time can be controlled accurately in watt and second level.There are so many techniques for mass-production of polymer microfluidic chip,such as heat bonding,ultrasonic bonding.However,we may find different kinds of shortages when we use these techniques.In this paper,the experiment result shows that microwave radiation’s strength and time have effects on microfluidic chip`s bonding strength.The microwave absorbing coating can also have a certain degree influence on microfluidic chip`s bonding strength.
microfluidic chip polymer microwave bonding technique
Xiaowei Liu Xiaowei Han He Zhang Xiyun Jiang Lin Zhao
MEMS Center, Harbin, Harbin Institute of Technology, Heilongjiang Province, China;Key Laboratory of MEMS Center, Harbin, Harbin Institute of Technology, Heilongjiang Province, China
国际会议
中国微米纳米技术学会第14届学术年会、第3届国际年会暨第6届微米纳米技术“创新与产业化国际研讨与展览会(CSMNT2012 & ICMAN2012)
杭州
英文
1-5
2012-11-04(万方平台首次上网日期,不代表论文的发表时间)