Numerical Study on Thermal Boundary Resistance and Conductive Properties of Cu/Al Interface

摘要：

　　In this paper,the thermal boundary resistance and conductive properties of Cu/Al interface are investigated by using first-principles calculations based on density functional theory (DFT) with considering the pressure influence.Based on the atomic model of Cu/Al interface the simulation results show that the lattice parameters for both Cu and Al are sensitive to pressure and density states of Cu/Al interface increase as pressure increases from 0 to 5 GPa.Although Cu and Al have the same atomic structure,the significant differences of the density of phonon states lead to the thermal resistance that exists at the Cu/Al interface.At the Cu/Al interface,Cu and Al atoms can diffuse into each other and form an alloy-like interfacial region.The change of the copper component in the alloy can considerably affect the conductive properties of Cu/Al interface.

关键词： Cu/Al interface thermal boundary resistance conductive properties copper component

作者: Zhi-Yong Ling Long Qian Guang-Gui Cheng Zhong-Qiang Zhang Dong-Jian Sun

作者单位: Center of Micro/Nano Science & Technology, Jiangsu University, Zhenjiang 212013,China

会议类型: 国际会议

会议名称: 中国微米纳米技术学会第14届学术年会、第3届国际年会暨第6届微米纳米技术“创新与产业化国际研讨与展览会(CSMNT2012 & ICMAN2012)

会议地点: 杭州

会议语种:英文

页码: 1-6

在线出版日期: 2012-11-04（万方平台首次上网日期，不代表论文的发表时间）