会议专题

InfluencInfluence of Package on Micro-accelerometer Sensitivity

  Package is one of the key technologies for micro-accelerometer.This paper researched the influence of package on the sensitivity of self-designed piezoresistive accelerometer.Based on the designed package method,the effect of thickness and elastic modulus of die adhesive,package shell materials and signal connection wires on the sensitivity of the sensor were studied by theory analysis,simulation and experimental test.According to results,the sensitivity of micro-accelerometer would be increased with the increasing thickness of die adhesive and decreased with increasing elastic modulus and the quantity of the die adhesive; besides,compared with accelerometer packaged by ceramic shell,the sensitivity of accelerometer packaged with the stainless steel shell was much bigger; meanwhile,the output sensitivity of the sensor varied with length of signal connection wire.

package micro-accelerometer sensitivity die process package materials

Ping Li Shi-Qiao Gao Lei Jin Hai-Peng Liu Yun-Bo Shi

State Key Laboratory of Explosion Science and Technology, Beijing Institute of Technology, Beijing10 Key Laboratory of Instrumentation Science & Dynamic Measurement, North University of China,Ministry

国际会议

中国微米纳米技术学会第14届学术年会、第3届国际年会暨第6届微米纳米技术“创新与产业化国际研讨与展览会(CSMNT2012 & ICMAN2012)

杭州

英文

1-6

2012-11-04(万方平台首次上网日期,不代表论文的发表时间)