Influence of Cu Diffusion on Electrical Transport Properties of Bi0.5Sb1.5Te3

摘要：

　　Bi0.5Sb1.5Te3 nanoplates from gas induced reduction (GIR) strategy were hot-pressed into bulk materials for thermoelectric properties investigation.During the electrical conductivity and Seebeck coefficient measurements,we found that the Cu from Cu electrodes diffused into samples when the measurement temperature was above 600 K.The phase composition and fracture surface of the samples before and after Cu diffusion were examined by X-ray diffraction (XRD),scanning electron microscope (SEM) and energy dispersive X-ray spectroscopy (EDS).We found that the Cu diffusion resulted in the composition deviation and formation of impurity phase,Cu1.8Te.When the electrical conductivity and Seebeck coefficient of the samples were measured again but below 600 K,the samples showed different electrical transport behavior and had enhanced power factors.

关键词： Bi0.5Sb1.5Te3 Electrical transport properties Cu diffusion Nanostructure

作者: Song Chen Xin Wang Zhigang Zou Kefeng Cai

作者单位: Functional Materials Research Laboratory, Tongji University, Shanghai 200092

会议类型: 国际会议

会议名称: the Chinese Materials Congress 2012(2012年中国材料大会(CMC2012))

会议地点: 太原

会议语种:英文

页码: 70-75

在线出版日期: 2012-07-13（万方平台首次上网日期，不代表论文的发表时间）