Preparation of Tungsten-copper Composite Powder by Electroless Plating

摘要：

　　In this paper,tungsten-copper composite powder was prepared on the particle size of 6~ 10μm tungsten powder surface by electroless copper plating.The orthogonal experimental results show that the primary and secondary order of factors affecting the deposition rate followwing the sequence: copper sulfate solution concentration > pH value>solution temperature> formaldehyde concentration > complexing agent concentration.The process of the electroless copper plating on the tungsten powder surface was investigated,and the best electroless copper plating solution composition and operation conditions were obtained as follows: plating temperature 323 K,stirring speed 30 r/min,PH =13,loadage 8g/L,CuSO4? 5H2O 0.032 mol/L,HCHO 0.274 mol/L,TEA 0.1208 mol/L,2,2 league pyridine 12 mg/L.

关键词： Tungsten-copper composite powder Electroless copper plating Orthogonal experimental Deposition rate

作者: Ying Wang Juntao Zou Qinghe Zhang

作者单位: School of Materials Science and Engineering, Xian University of Technology, Shaanxi Province,Xian 710048, China

会议类型: 国际会议

会议名称: the Chinese Materials Congress 2012(2012年中国材料大会(CMC2012))

会议地点: 太原

会议语种:英文

页码: 28-34

在线出版日期: 2012-07-13（万方平台首次上网日期，不代表论文的发表时间）