Study on the Interface Diffusion Bonding of the Copper Alloy/30CrMnSi Steel
The copper alloy/30CrMnSi steel bi-metal composite materials were prepared by the interface diffusion bonding method.The diffusion of elements close to the bonding interface was studied and the formation and growth mechanism of dissolution layer were discussed as well.The results showed that a diffusion transition layer could be formed with the different widths for copper alloy/30CrMnSi steel integrated material.A diffusion transition layer was formed close to 30CrMnSi steel side due to the inter-diffusion of the alloy elements.The microstructure characterization showed that no harmful brittle phase presented around the interface,and two heterogeneous materials had a good metallurgical bonding.
Copper alloy 30CrMnSi steel Interface diffusion Transition layer
Juntao Zou Yanfeng Liu Lu Pei Xianhui Wang Shuhua Liang
School of Materials Science and Engineering, Xian University of Technology, Xian 710048, China Department of Chemistry & Chemical Engineering, Shangluo University, Shangluo 726000, China
国际会议
the Chinese Materials Congress 2012(2012年中国材料大会(CMC2012))
太原
英文
168-172
2012-07-13（万方平台首次上网日期，不代表论文的发表时间）