Assessment of The Reliability of The Solder Joints of The Ultra-Fine-Pitch FCBGA
In this study,reliability assessment of the IMC layer of the ultra-fine-pitch FC-BGA(Flip-Chip Ball Grid Array) is conducted.The samples are prepared to reveal the differences in the adhesion forces of the IMC layer by dissimilarly establishing each plating thickness for surface finish(Ni/Pd/Au).The hardness and thickness of a P-rich Ni layer,which is known as the weakest section in ENPIG surface,are measured using the nanoindentation and TEM analysis.The degree of adhesion of the IMC layer under each experimental condition is evaluated and the metal plate shear test is performed for verification.The results showed significant correlations between the hardness and thickness of the IMC later and the high fraction defectives of the brittle fractures whose IMC layer had low hardness.
IMC layer brittle frracture nano-indentation Shear test
Joong-Soon Jang Kitae Kim Kihoon Yoo Kang-Dong Kim Jong-Min Kim Hyong-Rok Lee Sang-Won Lee
Graduate School of Industrial Engineering Ajou University Suwon, Korea Reliability Lab Samsung Electro-Mechanics Suwon, Korea
国际会议
成都
英文
797-800
2012-06-15（万方平台首次上网日期，不代表论文的发表时间）