Study on Heat Sink and Solder of C-Mount Packaged Semiconductor Laser

摘要：

The selection of semiconductor laser package materials including heat sink and solder has an important impact to the cooling and life of the laser, and thus performing related studies is very important. A C-Mount package semiconductor laser model was established in this paper, and thermal characteristic of different kinds of heat sink materials was simulated by the finite element software ANSYS. The temperature distribution of semiconductor laser was subsequently simulated. Then Cu was selected as heat sink, and In or AuSn was used as a solder, and the thermal stress distribution and thermal deformation of different solder materials were analyzed. The distribution of thermal stress of the semiconductor laser has also been investigated.

关键词： semiconductor laser ANSYS C-Mount package thermal resistance thermal stress

作者: Daoming Xi Yonggang Zou Xiaohui Ma Yang Li Zibin Yang Li Xu Wei Zhao Qingxue Sui Zhimin Zhang

作者单位: National Key Lab of High Power Semiconductor LasersChangchun University of Science and technology,Ch The Changchun Regional Office of the Armored ForcesRepresentative Bureau the Equipment Headquarters

会议类型: 国际会议

会议名称: 2012 International Conference on Optoelectronics and Microelectronics(2012光电子与微电子国际学术会议 2012 ICOM)

会议地点: 长春

会议语种:英文

页码: 68-72

在线出版日期: 2012-08-23（万方平台首次上网日期，不代表论文的发表时间）