Effect of bump shape on current density and temperature distributions in solder bump joints under electromigration
Three dimensional thermo-electrical finite element analysis was employed to simulate the current density and temperature distributions for solder bump joints with different bump shapes. Mean-time-to-failure (MTTF) of electromigration was discussed. It was found that as the bump volume increased from hourglass bump to barrel bump, the maximum current density increased but the maximum temperature decreased. Hourglass bump with waist radius of 240 μm has the longest MTTF.
Electromigration Bump shape MTTF
Yi Li XiuChen Zhao Ying Liu Hong Li
School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China
国际会议
厦门
英文
82-87
2012-06-05（万方平台首次上网日期，不代表论文的发表时间）