A New Anodic Bonding Method of Triple-stack Structure
Based on the triple-stack structure of sandwich of three-axis micro-accelerometer, a anodic bonding technology about three-layer of glass-silicon-glass is brought out. As the advantage of the triple-stack structure is introduced, the process of traditional anodic bonding is expounded. Since the bonding in the first time has led the layers of glass and silicon felt together, the strength of the first bonding will be destroyed if the electrode loads on the bonding glass-silicon surface directly in the second time. For this problem, the methed using dielectric material to pass bonding voltage is proposed. The results of the experiment show that the proposed new three-stack bonding method is simple and feasible.
Triple-Stack Bonding Anodic Bonding Medium Dielectric Material
Yuan Ye Cui Hong-juan Wang Xing-hua Xiao Ding-bang Wu Xue-zhong
School of Mechatronics Engineering and Automation National University of Defense Technology, Changsha 410073, China
国际会议
厦门
英文
153-158
2012-06-05（万方平台首次上网日期，不代表论文的发表时间）