ANALYSIS ON A THERMAL FRACTURE PROBLEM IN PACKAGING STRUCTURES

摘要：

In this paper,the interaction integral method combine with the finite element method (FEM) are introduced to study the thermal fracture behaviors of packaging structures.The modified interaction integral is provided for solving the fracture problems of packaging materials subject to thermal loading and the path-independence of the integral is still kept.Some numerical examples are checked to verify the present method.The temperature fields and the thermal stress fields are calculated and the thermal stress intensity factors (TSIFs) are extracted.The influences of the crack lengths and temperature fields on the TSIFs are also considered.

关键词： packaging structure interaction integral thermal stress intensity factors

作者: F.N.Guo L.C.Guo H.J.Yu

作者单位: Department of Astronautic Science and Mechanics,Harbin Institute of Technology,Harbin 150001,China

会议类型: 国际会议

会议名称: The Third International Conference on Heterogeneous Material Mechanics(第三届国际非均匀材料力学会议)

会议地点: 上海

会议语种:英文

页码: 969-972

在线出版日期: 2011-05-22（万方平台首次上网日期，不代表论文的发表时间）