Effect of the LaNd Addition on Melting Point and Spreading Properties of Bi5Sb8Sn Solder Alloy
Bi5Sb8Sn solder alloy is the most promising alternative to existing high-Pb solder as high-temperature lead-free soft solder alloy series whose melting point is about 264℃ and have better conductivity and mechanical properties, but its wettability need to be improved. In this paper a novel Bi5Sb8SnLaNd quaternary alloy have been developed by adding a small amount of mixed rare earth LaNd elements into Bi5Sb8Sn solder alloy to improve the technological properties of Bi5Sb8Sn alloys. The experimental results showed that adding 0.1~0.3wt.％ LaNd into Bi5Sb8Sn solder alloy made the melting point changed slightly, but resulted in the wettability of the solder alloy significant improvement. Compared with the matrix of Bi5Sb8Sn, the spreading area of solder alloy was about 20％ bigger when the content of LaNd is 0.1wt.％. With increasing the content of rare earth LaNd, the spreading area of solder alloy decreased, but it was still higher than that of the matrix of Bi5Sb8Sn. This may be mainly attributed to the formation of new phases with rare earth and the thickness of the substrate intermetallic compounds in the Bi5Sb8Sn solder alloy.
Bi5Sb8Sn solder alloy LaNd melting point wettability
SHENG Yang-yang YAN Yan-fu Han Cun-cang TANG Kun ZHAO Kuai-le XU Zhi-wei
Henan Key Laboratory of Advanced Non-ferrous Metals, Luoyang, Henan, China 471003 Department of Machine Engineering, Luoyang Institute of Science and Technology,Luoyang, China 471003 Luo Yang Hui Hang Mould Manufacture Co., Ltd, Luoyang, Henan, China 471003
国际会议
11th IUMRS International Conference in Asia(第十一届国际材联亚洲材料大会 IUMRS-ICA 2010)
青岛
英文
488-493
2010-09-25（万方平台首次上网日期，不代表论文的发表时间）