Formation and Evolution of Intermetallic Compounds in Solder Joint for Electronic Interconnect

摘要：

As solder joints become increasingly miniaturized to meet the severe demands of future electronic packaging, the thickness of intermetallic compounds (IMC) in solder joint continuously decreases, while, the IMC proportion to the whole solder joint increases. So IMC plays a more and more important role in the reliability of microelectronic structure and microsystems. In this paper, the formation and growth behavior, along with the composition of IMC at the interface of Sn-based solders/Cu substrate in soldering were reviewed comprehensively. The effect of isothermal aging, thermal-shearing cycling and electromigration on the interfacial IMC growth and evolution were also presented. Furthermore, the formation mechanism of Kirkendall voids during thermal aging was introduced. In addition, the effect of the interfacial IMC on mechanical properties of solder joints was in-depth summarized. Adopting an appropriate flux to control the thickness of the IMC to improve the reliability of solder joints and electronic products was proposed in the end of this paper.

关键词： Electronic packaging Interconnect solder joint Intermetallic compounds Mechanical properties Reliability

作者: Changhua Du Haijian Zhao Limeng Yin Fang Chen

作者单位: School of Materials Science and Engineering,Chongqing University of Technology, Chongqing 400050, Ch School of Metallurgy and Materials Engineering,Chongqing University of Science and Technology, Chong School of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400050, C

会议类型: 国际会议

会议名称: 11th IUMRS International Conference in Asia(第十一届国际材联亚洲材料大会 IUMRS-ICA 2010)

会议地点: 青岛

会议语种:英文

页码: 80-84

在线出版日期: 2010-09-25（万方平台首次上网日期，不代表论文的发表时间）