Interfacial microstructures and kinetics of Sn2.5Ag0.7Cu/Cu

摘要：

The interfacial microstructures and kinetics of low Ag content Sn2.5Ag0.7Cu/Cu solder joint were investigated by the X-ray diffraction, scanning electronic microscope and energy spectrum analysis during the isothermal aging. The results show that the interfacial microstructures of the Sn2.5Ag0.7Cu/Cu solder joint are composed of Cu3Sn and Cu6Sn5 after soldering. With the aging time increasing, the intermetallic compound (IMC) pattern of the solder joint interface can be changed from the scallop-like to the shape-layer, and the growing dynamics is coincidence with the law of parabola and its growing behavior is controlled by diffusion. The growing activation energies values of Cu3Sn and Cu6Sn5 layer at the Sn2.5Ag0.7Cu/Cu solder joint are 82.4kJ/mol and 69.6kJ/mol respectively.

关键词： SnAgCu solder alloy aging interfacial microstructure growing dynamics activation energy

作者: Yaoli Wang Keke Zhang Chenyang Li Lijuan Han Qingzhi Zhang

作者单位: Material Science & Engineering College, Henan University of Science & Technology,Luoyang 471003, Chi Material Science & Engineering College, Henan University of Science & Technology, Luoyang 471003, Ch

会议类型: 国际会议

会议名称: 11th IUMRS International Conference in Asia(第十一届国际材联亚洲材料大会 IUMRS-ICA 2010)

会议地点: 青岛

会议语种:英文

页码: 112-116

在线出版日期: 2010-09-25（万方平台首次上网日期，不代表论文的发表时间）