Microstructure and thermo-physical properties of TiB2/Si-30Al composite for electronic packaging applications

摘要：

2wt.％TiB2/Si-30Al composite was prepared by in-situ reaction and spray forming first and then by hot isostatic pressing (HIP). The microstructure and thermo-physical properties of the composite were investigated by means of scanning electron microscopy, and thermal expansion analyzer respectively. The results show that the microstructure of the TiB2/Si-30Al composite consists of a continuous network of primary Si (~35μm), interpenetrating secondary Al phase, and fine TiB2 particles (1~2μm). The TiB2 particles were uniformly distributed in the Si-30Al alloy matrix. After HIP, the pores in the TiB2/Si-30Al composite were almost eliminated, and the relative density of the composite was up to 98.9％. The 2wt.％TiB2/Si-30Al composite after the HIP exhibits good thermo-physical properties, including lower coefficient of thermal expansion (CTE) (6.6×10-6.K-1) and higher thermal conductivity (84 W.m-1.K-1).

关键词： spray forming TiB2/Si-30Al composite electronic packaging

作者: Guisheng Gan Lei Zhang Yi Lu Bin Yang

作者单位: State Key Laboratory for Advanced Metals and Materials, University of Science and TechnologyBeijing, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing

会议类型: 国际会议

会议名称: 11th IUMRS International Conference in Asia(第十一届国际材联亚洲材料大会 IUMRS-ICA 2010)

会议地点: 青岛

会议语种:英文

页码: 138-143

在线出版日期: 2010-09-25（万方平台首次上网日期，不代表论文的发表时间）