Effect of Temperature on Critical Stress for Slip of Ti-Ni Shape Memory Alloy
This study describes the effect of temperature on critical stress for slip of Ti-Ni shape memory alloy. Tensile loading-unloading tests has been carried out using Ti-50.3at％Ni in the temperature range from 193K to 423K in order to investigate the temperature dependence of critical stress for slip of Ti-Ni shape memory alloy. The critical stress for slip is different in the three regions which are the martensitic single phase state in the range of 193K-273K, the mixture state of the martensitic and parent phases in the range of 273K-373K and the parent single phase state in the range of 373K-423K. The critical stress for slip of the martensitic single phase is about 200MPa. In the case of the mixture state of the martensitic and parent phases, the critical stress for slip increases with increasing temperature, and reaches the maximum stress of 652MPa at 373K. The critical stress for slip of the parent phase decreases with increasing temperature.
Ti-Ni Shape Memory Alloy Critical Stress for Slip Temperature
Takaei Yamamoto Hiroki Cho Toshio Sakuma
Faculty of Engineering, Oita university, 700 Dannoharu, Oita-shi, Oita, 870-1192, Japan
国际会议
11th IUMRS International Conference in Asia(第十一届国际材联亚洲材料大会 IUMRS-ICA 2010)
青岛
英文
480-484
2010-09-25（万方平台首次上网日期，不代表论文的发表时间）