RESEARCH ON BONDING TECHNOLOGY PARAMETER OPTIMIZE OF NIPDAU PCB BASED ON MINITAB

摘要：

In order to improving reliability and economy of down-lead bonding of MEMS packaging , NiPdAu PCB is leaded in ,because palladium is joined in protecting involucra , bonding technology parameter must change .In this paper, robust parameter design method of MINITAB software is used and optimize bonding technology parameter of new type NiPdAu involucra has been discovered , according to optimize results , mending bonding technology parameter and Ni Pd Au PCB is triumphantly used into MEMS packaging technology , not only increasing reliability of products , but also reducing cost of raw materials and obtaining well economy benefit.

关键词： Packaging Bonding MEMS MINITAB software NiPdAu PCB

作者: JINWEI YU

作者单位: Weifang University

会议类型: 国际会议

会议名称: 2011 3rd International Conference on Computer Technology and Development(2011第三届计算机技术与发展国际会议 ICCTD2011)

会议地点: 成都

会议语种:英文

页码: 1985-1991

在线出版日期: 2011-11-25（万方平台首次上网日期，不代表论文的发表时间）