Gold Bonding Reliability in High Density FPGA Devices

摘要：

The formation of intermetallic mass along the edge of the ball has been observed inherent to the gold bonded Aluminum pads. In a well-bonded sample, it occurs only near the edge of the ball resulting to still strong, reliable bonds after the parts have been exposed at a long duration to elevated temperature. Hence, the presence of intermetallic mass along the periphery of the ball is not an indication of unreliable bond.

关键词： component Gold Bonding FPGA reliability

作者: Dechun Lv Guangyu Yang

作者单位: Institute of electronic engineering China academy of engineering physics Mianyang, China

会议类型: 国际会议

会议名称: 2011 International Conference on Electronics and Optoelectronics(2011电子学与光电子学国际会议 ICEOE 2011)

会议地点: 大连

会议语种:英文

页码: 395-398

在线出版日期: 2011-07-29（万方平台首次上网日期，不代表论文的发表时间）