Molecular Dynamics Simulations of Femtosecond Laser Ablation of Silicon
Molecular dynamics simulations were carried out to investigate the ablation process of silicon under irradiation of 266nm femtosecond laser. Evolutions of macro-variables were studied and final Profile and movement traces of atoms were obtained in Si(100) with laser intensity of 400GW/cm2. Characteristics of ablation processes of Si(100) and Si(lll) were compared. The amount of removal atoms and ablation depths were analyzed quantitatively in the two bulks with laser intensity of 400GW/cm2. Propagations of stress wave in the two bulks were also investigated.
molecular dynamics numerical simulations Laser Ablation, stress waves Silicon
Li-Mei, WANG Xinwu ZENG
College of Optoelectronic Engineering,National University of Defense Technology,Changsha, Hunan, Chi College of Optoelectronic Engineering,National University of Defense Technology,Changsha, Hunan, Chi
国际会议
2011 International Conference on Electronics and Optoelectronics(2011电子学与光电子学国际会议 ICEOE 2011)
大连
英文
415-418
2011-07-29(万方平台首次上网日期,不代表论文的发表时间)