Parameter Analysis of Hot Plate Based On Uniform Design

摘要：

In lithography process, wafers need to be baked on the hot plate. There are very high requirement to the temperature uniformity of hot plate surface. To the problem of choosing design parameters, the uniform design method and the simulation software ANSYS were used, the design parameters were analyzed on the various conditions. Then a regression model was obtained by dealing with these simulation data in quadratic regression. Test proven that the calculation result of the regression model is highly consistent with the result of simulation. So, the obtained regression model can be useful to choose the design parameters, it has practical value in the engineering.

关键词： hotplate uniform design regression

作者: Jingzhen Wang Weijun Liu

作者单位: Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang, China Graduate School of th Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang, China

会议类型: 国际会议

会议名称: 2011 International Conference on Electronics and Optoelectronics(2011电子学与光电子学国际会议 ICEOE 2011)

会议地点: 大连

会议语种:英文

页码: 566-568

在线出版日期: 2011-07-29（万方平台首次上网日期，不代表论文的发表时间）