Laser Induced Rear-Surface-Crack Damage Properties of HF etched Fused Silica

摘要：

The micro subsurface cracks of fused silica etched with HF solution were observed using AFM and optical microscope, and damage characteristics of crack at each etching state were studied. Experimental results show that inclusions in cracks play a important role in cracks damage behavior. After HF etching, inclusions were eliminated completely, configuration was transformed, and the initial damage threshold (IDT) was greatly improved. Experimental results show that HF etching wouldnt change the damage growth properties of cracks.

关键词： fused silica rear-surface crack HF etching damage property

作者: Wang Fengrui Huang Jin Liu Hongjie Zhou Xinda Jiang Xiaodong Wu Weidong Zheng Wanguo

作者单位: Laser Fusion Research Center CAEP Mianyang, China

会议类型: 国际会议

会议名称: 2011 International Conference on Electronics and Optoelectronics(2011电子学与光电子学国际会议 ICEOE 2011)

会议地点: 大连

会议语种:英文

页码: 842-845

在线出版日期: 2011-07-29（万方平台首次上网日期，不代表论文的发表时间）