A Numerical Method for Resistance Extraction of Conductors With Patered Cross Section and Random Rough Surface

摘要：

Interconnect play a crucial role in integrated circuit. As such, accurate interconnect modeling and characterization are key to the design and verification of integrated circuit. Copper (Cu) has became a mainstream material for interconnects and Cu interconnects are generally formed using the dual damascene process which cause the shape of line irregular. The paper analysis the impact of conductor surface roughness and the tapered line shape on the resistance of interconnects. In order to quantify these effects on the interconnect performance we develop the boundary elemental method (BEM) to calculate the frequency-dependent resistance. The results demonstrate that dimensions , RMS and the correlation length are important factors impacting on the variation of interconnect resistance.

关键词： interconnect resistance copper BEM

作者: Baojun Chen Zhenan Tang

作者单位: School of Electronic Science and Technology Dalian University of Technology Dalian, China

会议类型: 国际会议

会议名称: 2011 International Conference on Electronics and Optoelectronics(2011电子学与光电子学国际会议 ICEOE 2011)

会议地点: 大连

会议语种:英文

页码: 1166-1169

在线出版日期: 2011-07-29（万方平台首次上网日期，不代表论文的发表时间）