Calculation and Simulation of the Bending Deformation of Multilayer Thin Films Microcantilever Integrated with the Microplasma Reactor

摘要：

In order to realize maskless etching with the high resolution and high efficiency, a novel cantileverbased microplasma etching method is proposed in our previous work. The cantilever probe integrated with microplasma reactor is the multilayer structure. In the fabrication process of cantilever, the residue stress in multilayer thin films may cause undesirable bending of cantilever. This paper establishes the thermal stress calculation formula for the multilayer thin films microstructure and gets the relation between the cantilever deflection and internal stress. The stress in each film is experimentally measured. The deflection of cantilever is calculated by theoretical formula and simulated by ANSYS software as well. The accuracy error of the calculated and simulation is within 5％. It proves that the model has good practicability and provides a theoretical basis for controlling the deflection of multilayer thin films microcantilever and structural optimization.

关键词： Microcantilever deflection control residual stress finite element analysis

作者: Zhen Yuan Li Wen Leili Cheng Liwen He Jiaru Chu

作者单位: Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei, China

会议类型: 国际会议

会议名称: 2011 International Conference on Electronics and Optoelectronics(2011电子学与光电子学国际会议 ICEOE 2011)

会议地点: 大连

会议语种:英文

页码: 1204-1207

在线出版日期: 2011-07-29（万方平台首次上网日期，不代表论文的发表时间）