Failure on Multilayered Anisotropic Conductive Films (ACF) Packaging

摘要：

This paper develops a computational model for predicting the failure probability of multilayered packages fabricated using anisotropic conductive film (ACF).The ACF and NCA are stacked layers by layers, and spaced with each other.The analyzed pads array 10×10 combined with specified geometry parameters in the IC/ Substrate are used to analyze the failure probability.The computational results indicate that the multilayered analysis developed in this study can provide lower failure probability by means of reducing bridging effects for improving the ACF packaging yield.

关键词： anisotropic conductive film (ACF) non-conductive adhesive (NCA) multilayer V-shaped curve failure probability

作者: Chao-Ming Lin Tzu-Chao Lin Li-Ming Chu

作者单位: Graduate School of Opto-Mechatronics & Materials,WuFeng University,Taiwan,R.O.C. Department of Computer Science & Information Technology,WuFeng niversity,Taiwan,R.O.C. Department of Mechanical and Automation Engineering,I-Shou University,Taiwan,R.O.C.

会议类型: 国际会议

会议名称: 2011 2nd International Conference on Material and Manufacturing Technology(2011第二届材料与制造技术国际会议 ICMMT2011)

会议地点: 厦门

会议语种:英文

页码: 68-72

在线出版日期: 2011-07-08（万方平台首次上网日期，不代表论文的发表时间）