PCB Related Failures in Electronic Assemblies

摘要：

The complexity of Printed Circuit Boards (PCBs) has increased dramatically over the last three decades with the development of surface mount technology (SMT).The typical manufacture of rigid multilayer PCB contains many process procedures, which makes manufacture and application much more challenges. This paper focuses on some typical PCB related failures.Recommendations are provided on optimizing PCB manufacture process and material application. Microvia crack, black pad, galvanic attack, pad design, conductive anodic filament and pad crater are presented in detail.

关键词： PCB Solder joint Surface mount technology (SMT) black pad galvanic attack

作者: Ping Liu Xiaolong Gu Xinbing Zhao Xiaogang Liu

作者单位: Zhejiang Province Key Laboratory of Soldering & Brazing Materials and Technology,Zhejiang Metallurgi Zhejiang Province Key Laboratory of Soldering & Brazing Materials and Technology,Zhejiang Metallurgi Department of Materials Science and Engineering,Zhejiang University,Hangzhou 310027,PR China

会议类型: 国际会议

会议名称: 2011 2nd International Conference on Material and Manufacturing Technology(2011第二届材料与制造技术国际会议 ICMMT2011)

会议地点: 厦门

会议语种:英文

页码: 411-415

在线出版日期: 2011-07-08（万方平台首次上网日期，不代表论文的发表时间）