Analysis of the Tension and Creep Behavior of Ti-5Al-2.5Sn(wt. ％) Using In-Situ SEM Experiments
The deformation behavior of a Ti-5Al-2. 5Sn(wt. ％) near a alloy was investigated during in-situ deformation inside a scanning electron microscope (SEM). Tensile experiments were performed at 23℃ and 455℃ (≈0. 4Tm), andtensile-creep experiments were performed at 455℃. Both basal and prismatic slip systems were active during the 23℃ and 455°C tension tests,but deformation twinning was not observed. During 23t deformation,basal slip systems with Schmid factors greater than 0. 25 were observed. At 455°C ,basal slip was activated on systems with Schmid factors greater than 0. 1. During creep, grain boundary ledges formed, some of which evolved into grain boundary cracks, indicatingthat grain boundary sliding is an active deformation mechanism. Grain boundaries with initial misorientation angles greater than 30° tended to form ledges earlier in the deformation process than boundaries with lower misorientation angles. Less than 10％ of the grains imaged in-situ exhibited surface slip traces and a majority of these grains exhibited basal slip. The creep experiments revealed less slip and more grain boundary ledges than in the higher strain rate tensile experiments performed at the same temperature.
Titanium alloys slip trace deformation mechanism tension creep
Hongmei Li Carl J. Boehlert Thomas R. Bieler Martin A. Crimp
Department of Chemical Engineering and Materials Science,Michigan State University ,East Lansing ,MI 48824
国际会议
The 12th World Conference Titanium(第十二届世界钛会 Ti-2011)
北京
英文
937-941
2011-06-19（万方平台首次上网日期，不代表论文的发表时间）