Infrared Brazing Ti50Ni50 and Ti-15-3 Alloys Using Two Ag-based Fillers
Microstructural evolution of infrared brazed Ti50Ni50 shape memory alloy and Ti-15-3 using BAg-8 and Ticusil active braze alloys is performed in the study. Only Ticusil active braze readily wets both Ti50Ni50 and Ti-15-3 substrates. The wettability of Ag-Cu braze on Ti50Ni50 substrate is improved by adding 4. 5wt% Ti into the braze alloy. The brazed Ti50Ni50/BAg-8/Ti-15-3 joint is mainly comprised of Ag-rich matrix and Cu-Ti intermetallics. The formation of interfacial Cu-(Ni)-Ti intermetallic phases is attributed to the wetting of both substrates. The brazed Ti50Ni50/ Ticusil/Ti-15-3 joint shows more vigorous reaction among filler metal and both substrates, resulting in forming huge amount of Cu-Ni-Ti intermetallic compounds in the joint.
Infrared brazing Ti50Ni50 alloy Ti-15-3 alloy microstructure
T. E. Yang R. K. Shiue S. K. Wu
Department of Materials Science and Engineering, National Taiwan University, Taipei 106, Taiwan
国际会议
The 12th World Conference Titanium(第十二届世界钛会 Ti-2011)
北京
英文
1602-1606
2011-06-19(万方平台首次上网日期,不代表论文的发表时间)