Performance and Reliability Analysis of Bundled SWCNT as IC Interconnects

摘要：

This work has investigated the performance of Single-walled carbon nanotube bundle as futuristic interconnect material under process constraints and compared its suitability as IC interconnect material as per ITRS predictions. It also analyzes variance of each parasitic effect along with the variations in process parameters. This paper pinpoints the variables causing bottlenecks in realizing optimum performance and improving reliability. It also evaluates the effect of diameter variations of CNTs in an SWCNT bundle and metallic tube ratio on the performance and reliability for 22nm technological node. The results demonstrate that the relative variations in the resistance are critically effected by the variations in metallic tube ratios rather than diameter variations. The diameter variation introduces its critical effect only at global level.

关键词： CNT Interconnects bundled CNT propagation delay Performance analysis

作者: Nisha Kuruvilla J P Raina Arun Greig John Athulya A

作者单位: Center of Nanotechnology Research,VIT University,Vellore,Tamilnadu,India Department of Electronics,C Center of Nanotechnology Research,VIT University,Vellore,Tamilnadu,India Department of Electronics,College of Engineering,Chengannur,Kerala,India

会议类型: 国际会议

会议名称: 2010 International Conference on Material and Manufacturing Technology(2010材料与制造技术国际会议 ICMMT2010)

会议地点: 重庆

会议语种:英文

页码: 920-925

在线出版日期: 2010-09-17（万方平台首次上网日期，不代表论文的发表时间）